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Samsung and TSMC have made several important announcements about the present and future of their semiconductor manufacturing technologies in March. Samsung revealed that it had shipped over 70 thousand wafers processed using its first-generation 10 nm FinFET fabrication process (10LPE) and also announced major additions to its upcoming manufacturing technology roadmap. In particular, the company plans to introduce three processes it has not talked about thus far. TSMC said that it is about to start mass production of ICs (integrated circuits) using its first-gen 10 nm technology and also announced several new processes that will be launched in the coming years, including its first 7 nm EUV process due in 2019.